The Texas Instruments DMOS6 project is the largest ever semiconductor wafer fabrication facility – or MEGAFAB dedicated primarily to the production of digital signal processors (DSPs). TI’s DMOS6 facility is the company’s most advanced production facility with over 190,000 square feet of cleanroom space. In 2002, DMOS6 became one of the first 300mm facilities in the world to enter customer-qualified production on 130-nm copper wafers. Today, the company produces 16,000 wafers per month across multiple process generations. As demand for advanced products continues, DMOS6 is capable of producing up to 22,000 wafers per month. The project also included a 600,000-square-foot garage.